8 Layers Power Supply Rigid PCBA/ PCB Assembly (RoHS Compliant) Board

1. PCB fabrication capability: 1-20 layers ( including 12 to 20 layers for prototyping)
2. Maximum panel dimension: 762mm*508mm;
3. PCB material: FR-4 with Tg120 to 180 celsius degree;
4. Board thickness: 0.4mm to 4mm;
5. Thickness of inner layer copper: 1/2OZ~4OZ (17.5um~140um);
6. Thickness of outer layer base copper: 1/2OZ~5OZ (17.5um~175um);
8. Minimum laser hole size diameter: 4mil (0.1mm);
9. Thickness of solder mask: 0.4mil~1.2mil (10um~30um);
10. Hardness of solder mask: 6H;
11. Minimum track width/min track: 4mil/4mil (0.1mm/0.1mm);
12. Minimum dielectric thickness: 3mil (76.2um);
13. Minimum lengend line width/space: 5mil/5mil (125um/125um)
14. Drill hole size: 0.2mm to 6mm;
15. Soldermask and silkscreen colour available: black, white, yellow, red, blue, green;
16. V-cut acceptable; surface process: HASL, OSP, electroless immersion Tin, Gold, Silver; UL certification, ROHS compliant.
17. Product Application: Communications, Industry, Test and Control System, Medical Equipment, Computer, Aviation and Military.
Tina Zhang:odm(at)bqcdz(dot)com.